Memory startup Kepler Computing unveils high-density chip design without advanced lithography

The short version

• Founded in 2018, Kepler Computing announced an alternative high-bandwidth memory design using 3D stacking and a proprietary material.[Wired]
• The approach claims to boost chip density without requiring extreme ultraviolet lithography.[Wired]
• Backed by $468 million in funding and up to $245 million from the Commerce Department, the firm plans early sample shipments this year.[Wired]
• Manufacturing partner GlobalFoundries noted production requires isolation safeguards because iron is a difficult facility contaminant.[Wired]

Key facts

• Kepler Computing is a startup founded in 2018 that developed a new high-bandwidth memory architecture.[Wired]
• Kepler claims its 3D stacking technique and proprietary material increase density without relying on extreme ultraviolet lithography.[Wired]
• The company raised $468 million from investors including GlobalFoundries, Intel Capital, AMD Ventures, Baillie Gifford, and Bill Gates.[Wired]
• The US Department of Commerce pledged up to $245 million to Kepler in July.[Wired]
• Kepler aims to distribute initial HBM samples later this year, expand production in Singapore next year, and initiate US production in 2028.[Wired]

Sources

Outlet counts describe coverage, not independent confirmation. Reports may share a wire service or original source.

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