Technology
TSMC and Samsung commit to ASML advanced lithography tools
CNBC reports that major chipmakers are adopting high-end machines to support artificial intelligence manufacturing needs.
The short version
- Samsung and TSMC agreed to adopt ASML's High NA EUV lithography systems for future semiconductor manufacturing.[CNBC]
- The specialized machines can cost approximately $400 million each and are intended for advanced transistor designs.[CNBC]
- Samsung aims to use the equipment for DRAM production starting in 2028 before wider adoption in 2030.[CNBC]
- ASML intends to expand its overall EUV capacity by approximately 30% in 2027.[CNBC]
Key facts
- Samsung and TSMC have committed to adopting ASML's High NA extreme ultraviolet lithography equipment.[CNBC]
- Each High NA tool from ASML can cost roughly $400 million.[CNBC]
- Samsung stated plans to produce DRAM using the tools starting in 2028 and implement the technology in 2030.[CNBC]
- TSMC stated it expects tool usage to increase due to complex transistor architectures required for artificial intelligence applications.[CNBC]
- ASML plans to expand its total EUV manufacturing capacity by about 30% in 2027.[CNBC]
What remains uncertain
- ASML has not provided a recent forecast detailing how many High NA machines it expects to sell.[CNBC]
Sources
Outlet counts describe coverage, not independent confirmation. Reports may share a wire service or original source.